Atomic force microscope cantilevers with integrated actuation and sensing on the chip level provide several distinct advantages over conventional cantilever instrumentation. These include clean frequency responses, the possibility of down-scaling and parallelization to cantilever arrays as well as the absence of optical interferences. However, the two major difficulties with integrated transduction methods are a complicated fabrication process, often involving a number of fabrication steps, and a high amount of feedthrough from actuation to sensing electrodes. This work proposes two hybrid cantilever designs with piezoelectric actuators and piezoresistive sensors to reduce the actuator to sensor feedthrough. The designs can be realized using a commercial microelectromechanical systems fabrication process and only require a simple five-mask patterning and etching process. Finite element analysis results are presented to obtain modal responses, actuator gain and sensor sensitivities of the cantilever designs.
History
Source title
AIM 2018: IEEE/ASME International Conference on Advanced Intelligent Mechatronics
Name of conference
IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM 2018)
Location
Auckland, New Zealand
Start date
2018-07-09
End date
2018-07-12
Pagination
144-149
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Place published
Piscataway, NJ
Language
en, English
College/Research Centre
Faculty of Engineering and Built Environment
School
School of Electrical Engineering and Computer Science